Buckling structures, a relevant signature of Mechanical Properties of Film/Substrate systems

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Important Dates

Conference:

Apr. 22-24, 2019

Full Paper Due: Mar. 18, 2019

Abstract Due: Mar. 18, 2019

Audience Registration Due:
Apr. 22, 2019

Presentations of The Spring World Congress on Engineering and Technology (SCET 2017)

● Buckling structures, a relevant signature of Mechanical Properties of Film/Substrate systems
Author(s)
Christophe COUPEAU
Affiliation(s)
Institut Pprime, University of Poitiers
KEYWORDS
Buckling structures, relevant signature, Mechanical Properties,Film/Substrate systems
ABSTRACT
Thin films and coatings are used in a wide range of technological applications, such as microelectronics, packaging or optics. They often develop high residual stresses during the deposition process, sometimes about few GPa in compression. Such large compressive stresses may cause the nucleation and growth of buckling structures that generally result in the loss of functional properties that were initially conferred to such film/substrate composites. The aim of our studies is consequently to have a better understanding of the buckling phenomenon, by identifying the relevant parameters to prevent, to limit, or to control its occurrence.In particular, the fine investigation of the morphology of the buckling structures appears of great technological interest to qualitatively, or even quantitatively, extract some physical/mechanical parameters of the materials.